Electronic Packaging
SDA engineers have extensive experience packaging high performance electronics for use in hostile military environments. SDA can design electronic system enclosures for full military applications, commercial products (COTS insertion) in military applications, or commercial applications. Lightweight aluminum or composite material structures can be designed to meet stringent weight limits. SDA engineers have used standard milling techniques and chemical machining to lighten structures without compromising structural integrity. Structural analysis is routinely performed on new enclosure designs and is available to customers with existing enclosures that wish to validate their design.
With the increased use of commercial products in military applications, thermal management is critical to system readiness and reliability. SDA engineers are well versed in standard cooling techniques along with advanced techniques applicable to composite enclosures. Recent work with liquid cooling techniques provide customers with another option for high performance electronic systems or military applications using commercial circuit cards. Using a dielectric inert, environmentally friendly liquid, large amounts of heat can be removed via the change-of-phase phenomenon while maintaining a nearly constant component temperature. Change-of-phase technology using direct immersion or forced flow provides greatly enhanced system performance and reliability. Either method has the advantage of eliminating or reducing the thermal resistances in the path between electronic components and the cooling media.